Welcome to EIECS 2023 !
About to EIECS 2023 2023 3rd International Conference on Electronic Information Engineering and Computer Science The 2023 3rd International Conference on Electronic Information Engineering and Computer Science (EIECS 2023) will be held on September 22-24, 2023 in Changchun. This conference takes "bringing together global wisdom in scientific innovation to promote high-quality development" as the theme and focuses on electronic information engineering and computer science. This conference aims to boost development of the Computer Science Field, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on the global scale, improve academic cooperation between China and the outside world. It also aims to encourage exchange of information on research frontiers in different fields, connect the most advanced academic resources in China and abroad, turn research results into industrial solutions, bring together talents, technologies and capital to boost development. EIECS 2022 has been held as virtual event during September 16-18 , 2022. EIECS 2021 has been held in Changchun University of Science and Technology during September 23-26 , 2021. | ![]() |
CALL FOR PAPERS
1. Electronic Information Engineering Signal processing, Sensors ... 2. Computer Science Computer system, Big data ... 3. Other related topics For more information, please click: | SUBMISSION & PUBLICATION
For more information, please click: Submissione
For more information, please click: Publication |
IMPORTANT DATES
Full Paper Submission Date JUN. 23, 2023 | Registration Deadline AUG. 13, 2023 | Final Paper Submission Date AUG. 23, 2023 | Conference Dates SET. 22-24, 2023 |
SPEAKERS
Prof. Pingyi Fan Tsinghua University | Prof. De-Shuang Huang Tongji University, China | Prof. Carlo Vittorio Cannistraci Tsinghua University | Prof. Qinmin Yang Zhejiang University | Prof. Jumin Zhao Taiyuan University of Technology, China | Prof. Yiyuan Xie Southwest University, China |
ORGANIZER BY
TECHNICALLY CO-SPONSORED BY
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